| Heat Management |
| · Vapor Chamber thermal device patent |
| · Heat conductivity coefficient could reach 50,000 W/m· k, it's 129.5 times comparing with soild copper |
| · Vaporizing temperature is 34.5℃, hear is distributed instant |
| · High-pressured vacuum process for VC production ensures reliability |
| · Patented LED module combined with VC technology, without heat loss |
| · VC/LED module assembled with heat sink makes a good thermal solution |
| · simulated design with thermal analysis and efficiency optimization |
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